| Author | Message | ||
     Panshovevo |
For installing rectifier/regulators, is there any advantage to using electrically conductive paste? Or any reason not to? | ||
| Dannybuell |
They came with heat sink paste from the factory. Speculation at the time was that it was arctic silver. the silver heat sink paste +- ?? http://www.tomshardware.com/forum/264834-29-arctic -silver-themal-paste-gimmick-worth relocating your regulator into the air stream seems to be the most common solution. the computer folks have some interesting stuff... https://jet.com/product/detail/0caa94746f3345be9b2 974b9cd9fbb39?jcmp=pla:ggl:NJ_dur_Gen_Electronics_ a1:Electronics_Computers__Accessories_Computer_Com ponents_a1:na:PLA_785706707_43734971449_pla-290894 983102:na:na:na:2&code=PLA15 | ||
| Panshovevo |
I know they came with paste, but the paste is available in conductive and non-conductive formulations. For a metal case that grounds through the case, conductive would be the way to go, I think. | ||
| Araignee |
I used a silicon-free MIL-spec "heat-transfer" paste (McMaster-Carr 76645A12). The V/R (OEM and SH847) connect directly to the pos and neg battery terminals in the stock arrangement, but grounding the V/R case has always been a main point in installation instructions of every V/R I've ever used. This also includes electronic ignitions, alternators, relays, rev limiters, etc. It is commonly the first fault one is advised to look for in FAQ advice provided by manufacturers. That said, the main reason I used the paste was to help transfer as much heat away from the V/R to the rear subframe as possible. I powdercoated my subframe after lightening and trimming it a bit, but I made sure the heat sink for the V/R was masked off. Although the internal components of the SH847 are likely encased in epoxy for vibration and water resistance, the back of the case has an aluminum plate added, an additional cost likely justified by a need for good electrical and thermal conductivity. In my experience, electronic components don't like water, solvents, vibration, temperature extremes, adjacent magnetic or electronic fields, poor shielding, or weak connections. (Message edited by araignee on April 20, 2017) |
